10133834 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System under NSN 5962-01-200-7684, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

10133834

NSN: 5962-01-200-7684
FSC: 5962
CAGE: A486G — NIMIKKEISTOKESKUS NCB FINLAND (FIN)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
NSN	5962-01-200-7684

COMPONENT DIAGRAM

KEY FEATURES

•

MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS

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BODY HEIGHT: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN

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OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

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TERMINAL SURFACE TREATMENT: SOLDER

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MEMORY DEVICE TYPE: PROM

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CURRENT RATING PER CHARACTERISTIC: 125.00 MILLIAMPERES MAXIMUM SUPPLY

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

MEMORY CAPACITY: UNKNOWN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

MAXIMUM POWER DISSIPATION RATING	1.0 WATTS
BODY HEIGHT	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY DEVICE TYPE	PROM
CURRENT RATING PER CHARACTERISTIC	125.00 MILLIAMPERES MAXIMUM SUPPLY
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY CAPACITY	UNKNOWN
TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT
CASE OUTLINE SOURCE AND DESIGNATOR	D-10 MIL-M-38510

VERIFIED SUBSTITUTES & CROSS-REFERENCES 26

SC-5812-RCP-LVBInterchangeableGOVERNMENT REGISTRY