The SEMICONDUCTOR DEVICE,THYRISTOR is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.300 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.500 INCHES MAXIMUM IN, overall_diameter: 0.145 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: PNPN. This part is cataloged in the Federal Logistics Information System under NSN 5961-00-954-9106, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.300 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.500 INCHES MAXIMUM IN |
| overall_diameter | 0.145 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: PNPN |
| features_provided | HERMETICALLY SEALED CASE AND QUALITY ASSURANCE LEVEL TXV |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| terminal_circle_diameter | 0.200 INCHES NOMINAL IN |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| specification/standard_data | 81349-MIL-S-19500/356 GOVERNMENT SPECIFICATION |
| NSN | 5961-00-954-9106 |
| OVERALL LENGTH | 0.260 INCHES MAXIMUM IN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS JUNCTION DEGC |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| SEMICONDUCTOR MATERIAL | SILICON |
| MOUNTING METHOD | TERMINAL |
| TERMINAL CIRCLE DIAMETER | 0.200 INCHES NOMINAL IN |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| CURRENT RATING PER CHARACTERISTIC | 1.30 AMPERES MAXIMUM COLLECTOR CURRENT, DC |
| TERMINAL LENGTH | 1.500 INCHES MINIMUM IN |