PartsTable
Technical Data Sheet
10015943-004 ✓ Verified by PartsTable
· PROCESSOR · INTEL_XEON
WHAT YOU NEED TO KNOW
Intel Xeon processors — standard item. Cross-sell heatsink and fan.
PRODUCT OVERVIEW

INTEL XEON 18 CORE CPU GOLD 6140 24.75MB 2.30GHZ. Key specifications include material: PLASTIC PHENOLIC INSULATION, thread_length: 0.219 INCHES IN, overall_height: 0.844 INCHES IN, terminal_length: 0.250 INCHES IN, largest_diameter: 0.125 INCHES SINGLE END IN, basic_shape_style: NONTUBULAR, HEX. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5940-00-993-8823, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PROCESSOR INTEL_XEON 10015943-004
NSN: 5940-00-993-8823
FSC: 5940
CAGE: 18876 — US ARMY AVIATION AND MISSILE COMMAND (USA)
SPECIFICATIONS
materialPLASTIC PHENOLIC INSULATION
thread_length0.219 INCHES IN
overall_height0.844 INCHES IN
terminal_length0.250 INCHES IN
largest_diameter0.125 INCHES SINGLE END IN
basic_shape_styleNONTUBULAR, HEX
surface_treatmentCADMIUM MOUNTING FACILITY SINGLE LAYER
thru-hole_diameter0.030 INCHES IN
width_across_flats0.250 INCHES IN
mounting_method_styleSTUD
turret_minor_diameter0.065 INCHES SINGLE END IN
mounting_thread_seriesUNIFIED NATIONAL COARSE (UNC)
NSN5940-00-993-8823
COMPONENT DIAGRAM
PIN 1 SERVER CPU PROCESSOR LGA/SP SOCKET 76.0 mm 56.5 mm LGA/SP SOCKET — Server CPU Pin 1 alignment triangle IHS — Nickel-plated copper Thermal interface to heatsink TDP — 35W to 400W Bronze / Silver / Gold / Platinum CONTACT — LGA pads Socket-side pins (not on CPU) TITLE SERVER CPU PN 10015943-004 MFR INTEL XEON 18 CORE CPU GOLD 6140 24.75MB
KEY FEATURES
24.75MB Capacity
THRU-HOLE DIAMETER: 0.030 INCHES IN
MOUNTING THREAD DIAMETER: 0.122 INCHES IN
MOUNTING THREAD SERIES: UNIFIED NATIONAL COARSE (UNC)
WIDTH ACROSS FLATS: 0.250 INCHES IN
SURFACE TREATMENT: TIN CONDUCTOR ACCOMMODATION SINGLE LAYER
CONDUCTOR ACCOMMODATION TYPE: DOUBLE TURRET SINGLE END
BASIC SHAPE STYLE: NONTUBULAR, HEX
TYPICAL APPLICATIONS
  • Enterprise virtualization host density upgrades
  • Database server performance scaling
  • AI/ML inference workloads
  • High-performance computing (HPC) clusters
TECHNICAL CHARACTERISTICS (FLIS)
OVERALL HEIGHT0.844 INCHES IN
THRU-HOLE DIAMETER0.030 INCHES IN
MOUNTING THREAD DIAMETER0.122 INCHES IN
MOUNTING THREAD SERIESUNIFIED NATIONAL COARSE (UNC)
WIDTH ACROSS FLATS0.250 INCHES IN
SURFACE TREATMENTTIN CONDUCTOR ACCOMMODATION SINGLE LAYER
CONDUCTOR ACCOMMODATION TYPEDOUBLE TURRET SINGLE END
BASIC SHAPE STYLENONTUBULAR, HEX
MATERIAL DOCUMENT AND CLASSIFICATIONMIL-M-14,TY MME MIL SPEC SINGLE MATERIAL RESPONSE INSULATION
ELECTRICAL INSULATION FEATURESTANDOFF INSULATION
VERIFIED SUBSTITUTES & CROSS-REFERENCES 12
RKD49-6-2CPC10Interchangeable
interchangeable cross-reference
interchangeable
6140Interchangeable
Intel Xeon 18 Core CPU Gold 6140 24.75MB 2.30ghz
interchangeable
ARKD49-6-2CPC10Interchangeable
interchangeable cross-reference
interchangeable
367-0121-000Interchangeable
interchangeable cross-reference
interchangeable
19-2880Interchangeable
interchangeable cross-reference
interchangeable
SK19-2880Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99Not HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 10015943-004?
10015943-004 is a INTEL XEON 18 CORE CPU GOLD 6140 24.75MB 2.30GHZ. It is classified as a PROCESSOR (INTEL_XEON).
What parts can replace 10015943-004?
There are 12 known substitutes for 10015943-004: RKD49-6-2CPC10, 6140, ARKD49-6-2CPC10 and 9 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 10015943-004?
10015943-004 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5940-00-993-8823. This indicates validated use in U.S. government and defense supply chains.
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