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PartsTable / COMPONENT / 100-DL209
100-DL209 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-306-0382, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
100-DL209
NSN: 5962-01-306-0382
FSC: 5962
CAGE: 56053 — NORTHROP GRUMMAN DEFENSE MISSION SYSTEMS, INC. (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length1.490 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern17 INPUT
NSN5962-01-306-0382
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 100-DL209 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-10 MIL-M-38510
•
TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 6.5 VOLTS MAXIMUM POWER SOURCE
•
MEMORY DEVICE TYPE: ROM
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE
CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
VOLTAGE RATING AND TYPE PER CHARACTERISTIC6.5 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPEROM
TERMINAL SURFACE TREATMENTSOLDER
TIME RATING PER CHACTERISTIC250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
MEMORY CAPACITYUNKNOWN
INCLOSURE MATERIALCERAMIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
SMJ27256-25JMInterchangeable
interchangeable cross-reference
interchangeable
7119938Interchangeable
interchangeable cross-reference
interchangeable
115587-0001Interchangeable
interchangeable cross-reference
interchangeable
8411102YAInterchangeable
interchangeable cross-reference
interchangeable
15-2726567-002Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 247Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 100-DL209?
100-DL209 is a MICROCIRCUIT,MEMORY.
What parts can replace 100-DL209?
There are 16 known substitutes for 100-DL209: SMJ27256-25JM, 7119938, 115587-0001 and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 100-DL209?
100-DL209 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-306-0382. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026