0N444111-2: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.232 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-260-8680, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.610 INCHES MAXIMUM IN |
| body_height | 0.232 INCHES MAXIMUM IN |
| body_length | 1.490 INCHES MAXIMUM IN |
| features_provided | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 21 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-260-8680 |
| INPUT CIRCUIT PATTERN | 21 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.610 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.232 INCHES MAXIMUM IN |
| FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 125.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | RAM |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |