0N385749-1 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

0N385749-1: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND HIGH SPEED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-315-9061, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

0N385749-1

NSN: 5962-01-315-9061
FSC: 5962 — Microcircuits, Electronic
CAGE: 98230 — NATIONAL SECURITY AGENCY (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND HIGH SPEED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
specification/standard_data	81349-MIL-M-38510/657 GOVERNMENT SPECIFICATION
NSN	5962-01-315-9061

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 8 DRIVER, BUS

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND HIGH SPEED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	8 DRIVER, BUS
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND HIGH SPEED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
SPECIFICATION/STANDARD DATA	81349-MIL-M-38510/657 GOVERNMENT SPECIFICATION

SUBSTITUTES & CROSS-REFERENCES 9

CD74HC541EReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

SNJ54HC541J-00Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

M38510/65711BRASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

MC54HC541J/883BReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

MIL-M-38510/657Reference document

Same NSN cross-reference

Reference document — Identification reference

CD54HC541F/3AReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 0N385749-1?

0N385749-1 is a MICROCIRCUIT,DIGITAL.

What parts can replace 0N385749-1?

There are 9 known substitutes for 0N385749-1: CD74HC541E, SNJ54HC541J-00, M38510/65711BRA and 6 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 0N385749-1?

0N385749-1 is cataloged in the U.S. Government catalog under NSN 5962-01-315-9061. This indicates validated use in U.S. government and defense supply chains.

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