08684-80007 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

08684-80007: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: ELECTROSTATIC SENSITIVE AND PROGRAMMED AND MONOLITHIC, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-220-0679, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

08684-80007

NSN: 5962-01-220-0679
FSC: 5962 — Microcircuits, Electronic
CAGE: 28480 — HEWLETT-PACKARD COMPANY DBA HP (USA)

SPECIFICATIONS

features_provided	ELECTROSTATIC SENSITIVE AND PROGRAMMED AND MONOLITHIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-220-0679

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND PROGRAMMED AND MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND PROGRAMMED AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

08684-80012Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 08684-80007?

08684-80007 is a MICROCIRCUIT,MEMORY.

What parts can replace 08684-80007?

There are 2 known substitutes for 08684-80007: 08684-80012, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 08684-80007?

08684-80007 is cataloged in the U.S. Government catalog under NSN 5962-01-220-0679. This indicates validated use in U.S. government and defense supply chains.

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08684-80007 — MICROCIRCUIT,MEMORY

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