08562-80030 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

08562-80030: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.246 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM IN, overall_width: 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, overall_height: 0.330 INCHES NOMINAL IN, overall_length: 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-326-4309, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

08562-80030

NSN: 5962-01-326-4309
FSC: 5962 — Microcircuits, Electronic
CAGE: 7ZXR5 — KEYSIGHT TECHNOLOGIES INC (USA)

SPECIFICATIONS

body_width	0.246 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM IN
overall_width	0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
overall_height	0.330 INCHES NOMINAL IN
overall_length	0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM IN
features_provided	BURN IN AND ELECTROSTATIC SENSITIVE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-326-4309

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.246 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.330 INCHES NOMINAL IN
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.246 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
OVERALL LENGTH	0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM IN
OVERALL WIDTH	0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 08562-80030?

08562-80030 is a MICROCIRCUIT,MEMORY.

What parts can replace 08562-80030?

There is 1 known substitute for 08562-80030: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 08562-80030?

08562-80030 is cataloged in the U.S. Government catalog under NSN 5962-01-326-4309. This indicates validated use in U.S. government and defense supply chains.

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08562-80030 — MICROCIRCUIT,MEMORY

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