CONNECTOR,RECEPTACLE,ELECTRICAL. Key specifications include color: GRAY/GREY, material: PLASTIC EPOXY, physical_form: PASTE, special_features: NON-SAG; RESISTANT TO AUTOMOTIVE FLUIDS, IMPACT AND FATIGUE PRODUCT MUST BE STORED AT ROOM TEMPERATURE 60-80 DEG F DEGF, features_provided: SEPARATE CATALYST, supplementary_features: 50 MILLILITER DUAL CARTRIDGE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 8040-01-612-7283, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| color | GRAY/GREY |
| material | PLASTIC EPOXY |
| physical_form | PASTE |
| special_features | NON-SAG; RESISTANT TO AUTOMOTIVE FLUIDS, IMPACT AND FATIGUE PRODUCT MUST BE STORED AT ROOM TEMPERATURE 60-80 DEG F DEGF |
| features_provided | SEPARATE CATALYST |
| specific_usage_design | FOR BONDING DISSIMILAR SUBSTRATES INCLUDING METALS, ENGINEERING THERMOPLASTICS AND THERMOSET LAMINATES SUCH AS SHEET MOLDING COMPOUND (SMC) WITHOUT THE USE OF PRIMERS |
| supplementary_features | 50 MILLILITER DUAL CARTRIDGE |
| quantity_within_each_unit_package | 50.000 MILLILITERS |
| NSN | 8040-01-612-7283 |
| COLOR | GRAY/GREY |
| SPECIAL FEATURES | NON-SAG; RESISTANT TO AUTOMOTIVE FLUIDS, IMPACT AND FATIGUE PRODUCT MUST BE STORED AT ROOM TEMPERATURE 60-80 DEG F DEGF |
| SPECIFIC USAGE DESIGN | FOR BONDING DISSIMILAR SUBSTRATES INCLUDING METALS, ENGINEERING THERMOPLASTICS AND THERMOSET LAMINATES SUCH AS SHEET MOLDING COMPOUND (SMC) WITHOUT THE USE OF PRIMERS |
| MATERIAL | PLASTIC EPOXY |
| PHYSICAL FORM | PASTE |
| QUANTITY WITHIN EACH UNIT PACKAGE | 50.000 MILLILITERS |
| FEATURES PROVIDED | SEPARATE CATALYST |
| SUPPLEMENTARY FEATURES | 50 MILLILITER DUAL CARTRIDGE |