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Technical Data Sheet
05342-80007 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.180 INCHES NOMINAL IN, body_length: 0.870 INCHES MAXIMUM IN, bit_quantity: 256, word_quantity: 32, features_provided: 3-STATE OUTPUT AND W/OPEN COLLECTOR AND PROGRAMMABLE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-170-0600, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
05342-80007
NSN: 5962-01-170-0600
FSC: 5962
CAGE: 50440 — AGILENT TECHNOLOGIES INC. DIV AGILENT SOLUTION SUPPORT (USA)
SPECIFICATIONS
body_width0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height0.180 INCHES NOMINAL IN
body_length0.870 INCHES MAXIMUM IN
bit_quantity256
word_quantity32
features_provided3-STATE OUTPUT AND W/OPEN COLLECTOR AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialPLASTIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
NSN5962-01-170-0600
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 05342-80007 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
BIT QUANTITY: 256
BODY LENGTH: 0.870 INCHES MAXIMUM IN
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
FEATURES PROVIDED: 3-STATE OUTPUT AND W/OPEN COLLECTOR AND PROGRAMMABLE
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
OPERATING TEMP RANGE: -0.0 TO 70.0 CELSIUS DEGC
INCLOSURE MATERIAL: PLASTIC
MAXIMUM POWER DISSIPATION RATING: 400.0 MILLIWATTS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BIT QUANTITY256
BODY LENGTH0.870 INCHES MAXIMUM IN
BODY WIDTH0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
FEATURES PROVIDED3-STATE OUTPUT AND W/OPEN COLLECTOR AND PROGRAMMABLE
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OPERATING TEMP RANGE-0.0 TO 70.0 CELSIUS DEGC
INCLOSURE MATERIALPLASTIC
MAXIMUM POWER DISSIPATION RATING400.0 MILLIWATTS
TERMINAL SURFACE TREATMENTSOLDER
INCLOSURE CONFIGURATIONDUAL-IN-LINE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 23
N82S23NInterchangeable
interchangeable cross-reference
interchangeable
N8223BInterchangeable
interchangeable cross-reference
interchangeable
1816-0004Interchangeable
interchangeable cross-reference
interchangeable
SN74S188NInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 022Interchangeable
interchangeable cross-reference
interchangeable
1816-0184Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 05342-80007?
05342-80007 is a MICROCIRCUIT,MEMORY.
What parts can replace 05342-80007?
There are 23 known substitutes for 05342-80007: N82S23N, N8223B, 1816-0004 and 20 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 05342-80007?
05342-80007 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-170-0600. This indicates validated use in U.S. government and defense supply chains.
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