050-1200: PARTS KIT,SEAL REPLACEMENT,MECHA.
PARTS KIT,SEAL REPLACEMENT,MECHA. Key specifications include material: SILICONE, temp_rating: 400.0 FAHRENHEIT DEGF, physical_form: PASTE, specific_usage_design: FOR ELECTRONICS BONDING APPLICATIONS, supplementary_features: 1-1/2 OUNCE TUBE OZ, quantity_within_each_unit_package: 1.500 OUNCES OZ. This part is cataloged in the U.S.
Government catalog under NSN 8040-01-533-2436, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICONE |
| temp_rating | 400.0 FAHRENHEIT DEGF |
| physical_form | PASTE |
| special_features | SILVER PLATED ALUMINUM FILLER; ELECTRICALLY CONDUCTIVE; SERVICE TEMPERATURE RANGE OF MINUS 55 DEG F TO PLUS 400 DEG F;STORE BELOW 73 DEGREES F DEGF |
| specific_usage_design | FOR ELECTRONICS BONDING APPLICATIONS |
| supplementary_features | 1-1/2 OUNCE TUBE OZ |
| quantity_within_each_unit_package | 1.500 OUNCES OZ |
| NSN | 8040-01-533-2436 |
| TEMP RATING | 400.0 FAHRENHEIT DEGF |
| SUPPLEMENTARY FEATURES | 1-1/2 OUNCE TUBE OZ |
| QUANTITY WITHIN EACH UNIT PACKAGE | 1.500 OUNCES OZ |
| PHYSICAL FORM | PASTE |
| COLOR | SILVER |
| SPECIAL FEATURES | SILVER PLATED ALUMINUM FILLER; ELECTRICALLY CONDUCTIVE; SERVICE TEMPERATURE RANGE OF MINUS 55 DEG F TO PLUS 400 DEG F;STORE BELOW 73 DEGREES F DEGF |
| SPECIFIC USAGE DESIGN | FOR ELECTRONICS BONDING APPLICATIONS |
| MATERIAL | SILICONE |
No substitute or cross-reference records for this part.