046457 — SEMICONDUCTOR DEVICE ASSEMBLY

✓ Government record, cited

— · SFP TRANSCEIVER

PRODUCT OVERVIEW

046457: SEMICONDUCTOR DEVICE ASSEMBLY.

The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include major_components: HEAT SINK 1; DIODE 3; CAPACITOR 2. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-124-6492, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

046457

NSN: 5961-01-124-6492
NIINs: 011246492, 012288202
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 3BH04 — MILLER ELECTRIC MFG. LLC (USA)

SPECIFICATIONS

major_components	HEAT SINK 1; DIODE 3; CAPACITOR 2
NSN	5961-01-124-6492

COMPONENT DIAGRAM

KEY FEATURES

•

MAJOR COMPONENTS: HEAT SINK 1; DIODE 3; CAPACITOR 2

TECHNICAL CHARACTERISTICS

MAJOR COMPONENTS

HEAT SINK 1; DIODE 3; CAPACITOR 2

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 046457?

046457 is a SEMICONDUCTOR DEVICE ASSEMBLY.

What is the NSN for 046457?

046457 is cataloged in the U.S. Government catalog under NSN 5961-01-124-6492. This indicates validated use in U.S. government and defense supply chains.

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046457 — SEMICONDUCTOR DEVICE ASSEMBLY

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