The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN, body_length: 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-219-7312, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN |
| body_length | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | QUAD 3 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 PRINTED CIRCUIT |
| NSN | 5962-00-219-7312 |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN |
| TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY LENGTH | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN |
| MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AD JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |