01K1132: COMPUTER SUBASSEMBLY.
The COMPUTER SUBASSEMBLY is a the manufacturer industrial component. Key specifications include OVERALL WIDTH: 0.400 INCHES NOMINAL IN, OVERALL HEIGHT: 5.250 INCHES NOMINAL IN, OVERALL LENGTH: 1.000 INCHES NOMINAL IN, SPECIAL FEATURES: 256 MB MEMORY; ECC SDRAM; DIMM; 100 MHZ ACCESS TIME; 168 PIN CONNECTOR; BUFFERED MEMORY MODULE; GOLD PLATING ON PINS MB, PRECIOUS MATERIAL AND LOCATION: CONTACT SURFACES GOLD. This part is cataloged in the U.S.
Government catalog under NSN 7021-01-461-9730, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| OVERALL WIDTH | 0.400 INCHES NOMINAL IN |
| OVERALL HEIGHT | 5.250 INCHES NOMINAL IN |
| OVERALL LENGTH | 1.000 INCHES NOMINAL IN |
| SPECIAL FEATURES | 256 MB MEMORY; ECC SDRAM; DIMM; 100 MHZ ACCESS TIME; 168 PIN CONNECTOR; BUFFERED MEMORY MODULE; GOLD PLATING ON PINS MB |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD |
| NSN | 7021-01-461-9730 |
| OVERALL HEIGHT | 5.250 INCHES NOMINAL IN |
| OVERALL LENGTH | 1.000 INCHES NOMINAL IN |
| OVERALL WIDTH | 0.400 INCHES NOMINAL IN |
| SPECIAL FEATURES | 256 MB MEMORY; ECC SDRAM; DIMM; 100 MHZ ACCESS TIME; 168 PIN CONNECTOR; BUFFERED MEMORY MODULE; GOLD PLATING ON PINS MB |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD |
No substitute or cross-reference records for this part.