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0117952-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

0117952-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN, body_height: 0.155 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 2.096 INCHES MAXIMUM IN, overall_height: 0.425 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-340-9354, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
0117952-1
NSN: 5962-01-340-9354
FSC: 5962 — Microcircuits, Electronic
CAGE: 55910 — NIWC PACIFIC SAN DIEGO NAVY ERP DBA NAVAL INFORMATION WARFARE CENTER PACIFIC DIV NAVAL INFORMATION WARFARE CENTER PACIFIC (USA)
SPECIFICATIONS
body_width0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
body_height0.155 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
body_length2.096 INCHES MAXIMUM IN
bit_quantity8
overall_height0.425 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeCROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-340-9354
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 0117952-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 8
•
INPUT CIRCUIT PATTERN: 34 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.155 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY8
OVERALL HEIGHT0.425 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN34 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
BODY HEIGHT0.155 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC40.00 MILLIAMPERES MAXIMUM SUPPLY
SUBSTITUTES & CROSS-REFERENCES 3
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8768401BQAReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8768401QAReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 0117952-1?
0117952-1 is a MICROCIRCUIT,MEMORY.
What parts can replace 0117952-1?
There are 3 known substitutes for 0117952-1: ROM/PROM, 5962-8768401BQA, 5962-8768401QA. Substitute compatibility should be verified for your specific system.
What is the NSN for 0117952-1?
0117952-1 is cataloged in the U.S. Government catalog under NSN 5962-01-340-9354. This indicates validated use in U.S. government and defense supply chains.
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