CULTURE MEDIUM,BISMUTH SULFITE A. Key specifications include overall_width: 3.187 INCHES NOMINAL IN, overall_height: 0.875 INCHES NOMINAL IN, overall_length: 3.812 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5998-00-456-4905, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 3.187 INCHES NOMINAL IN |
| overall_height | 0.875 INCHES NOMINAL IN |
| overall_length | 3.812 INCHES NOMINAL IN |
| special_features | CAPACITORS,FIXED 3; COIL,RF 1; CONTACTS,HERMAPHRODITE 8; HEAT SINKS 2; PADS,TRANSISTOR 6; PRINTED WIRING BOARD 1; RESISTORS,FIXED 12; SEMICONDUCTOR DEVICE,DIODES 3; TRANSISTORS 6 |
| NSN | 5998-00-456-4905 |
| OVERALL LENGTH | 3.812 INCHES NOMINAL IN |
| SPECIAL FEATURES | CAPACITORS,FIXED 3; COIL,RF 1; CONTACTS,HERMAPHRODITE 8; HEAT SINKS 2; PADS,TRANSISTOR 6; PRINTED WIRING BOARD 1; RESISTORS,FIXED 12; SEMICONDUCTOR DEVICE,DIODES 3; TRANSISTORS 6 |
| OVERALL HEIGHT | 0.875 INCHES NOMINAL IN |
| OVERALL WIDTH | 3.187 INCHES NOMINAL IN |
| OVERALL LENGTH | 3.812 INCHES NOMINAL IN |
| SPECIAL FEATURES | CAPACITORS,FIXED 3; COIL,RF 1; CONTACTS,HERMAPHRODITE 8; HEAT SINKS 2; PADS,TRANSISTOR 6; PRINTED WIRING BOARD 1; RESISTORS,FIXED 12; SEMICONDUCTOR DEVICE,DIODES 3; TRANSISTORS 6 |
| OVERALL HEIGHT | 0.875 INCHES NOMINAL IN |
| OVERALL WIDTH | 3.187 INCHES NOMINAL IN |